3. 半導體與構裝技術的發展是連結晶圓製程與電路板製程的重要關鍵，下列關於構裝技術的演進順序何者正確？ (A) Surface Mount  Pin-Through Hole  Ball Grid Array  Through-Silicon Via；(B) Pin-Through Hole  Surface Mount  Ball Grid Array  ThroughSilicon Via；(C) Surface Mount  Ball Grid Array  Pin-Through Hole  Through-Silicon Via；(D) Through-Silicon Via  Surface Mount  Ball Grid Array  Pin-through Hole